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H2600

FEATURES 

CTI≥600

Excellent processing performance

Not recommended for solder mask rework


APPLICATIONS

Power base board、TV、Refrigerator、Washing machine,etc.

                                

 

GENERAL PROPERTIES

Item

  IPC-TM-650

Test Condition

Unit

Typical value

Glass transition temp.

2.4.25

DSC

126

Decomposition Temp.

2.4.24.6

TGA

335

T288

2.4.24.1

TMA,unclad

min

1

Thermal stress

2.4.13.1

unclad

sec

60

Water absorption

2.6.2.1

E-1/105+D-24/23

%

0.17

Peel Strength/18μm

2.4.8

as received

lb/in

8.5

after thermal stress

lb/in

8.5

Permittivity(RC50%)

2.5.5.9

C-24/23/50,1G

/

4.7

Loss tagent(RC50%)

2.5.5.9

C-24/23/50,1G

/

0.016

Volume resistivity

2.5.17.1

C-96/35/90

MΩ·cm

2.31*108

Surface resistivity

2.5.17.1

C-96/35/90

MΩ

2.37*106

Arc Resistance

2.5.1

D48/50+D0.5/23

sec

120

Dielectric Breakdown

2.5.6

D48/50+D0.5/23

kV

55

Flexural strength

Warp

2.4.4

as received

MPa

380

Fill

2.4.4

as received

MPa

310

Flame resistance

UL-94

A&E-24/125

/

V0

CTI

C-96/20/65

IEC-60112

Rating

PLC0

 

u  Specimen Thickness:1.6mm.Specification sheet:IPC-4101/12, for reference only.


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